Showing results: 1 - 15 of 19 items found.
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National Technical Systems
Solder joint reliability is defined as the ability of your product’s solder joints to function under given conditions and for a specified period of time without exceeding acceptable failure levels.Whether you are trying to implement a new solder type or new component types, solder joint reliability testing is essential in providing confidence that your product will perform within its intended operating limits. The results from different test programs can be compared to provide an understanding of design requirements for adequate reliability. This provides you with useful technical information for future designs, saving you time and money.
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DMC, Inc.
DMC developed the software to inspect the solder joints of automotive power door lock switches.
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S3088 ultra -
Viscom AG
*Extremely fast AOI camera system.*Scalable, modular camera technology with 3D measuring function.*Greatest inspection depth: reliable inspection of 03015 und fine-pitch components.*Maximum fault coverage - 9 views plus 3D measurement.*Best resolution at angled views.*Height measurement of components.*Extremely high throughput due to FastFlow Handling.*Revolutionary simplicity in AOI operation with vVision.*Fast program generation with vVision/EasyPro.*Reading DataMatrix code, bottom up.
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Zenith -
Koh Young Technology
The Zenith 3D AOI system measures the true profilometricshape of components, solder joints, patterns and even foreignmaterial on assembled PCBs with true 3 dimensional measurement, overcoming the shortcomings and vulnerabilities of 2D AOI.
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Delserro Engineering Solutions
Delserro Engineering Solutions is your complete source forHALT/HASS, Accelerated Life Testing, Environmental Testing, Lead Free Solder Joint Reliability Testing, Linear andNon-Linear FEA, Computational Fluid Dynamics (CFD)
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X-eye 6200 -
SEC Co., Ltd.
Automatically in-line inspect Solder joint defects of PCBA, and other defects on Hidden Components.Able to judge Good/NG fast with inspection speed of 1sec/FOV and the program can set ROIs conveniently.Performing X-ray inspection in various production site, integrated with other manufacturing equipements.
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STD Series -
Analysis Tech Inc.
The STD Series Event Detectors offer test specifications associated with solder joint reliability testing but can also be used for testing other types of interconnects accordingly. Like other Event Detectors, the STD series provides continuous transient resistance detection referenced to a selected threshold resistance with a high degree of electrical noise immunity.
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Sherlock-300I -
Manncorp
Add PCB inspection to your automated production line, pre- or post-reflow, and speed up your process. Inline Sherlock 300I AOI system inspects components and solder joints on SMT, through-hole and mixed-technology boards and communicates with downstream equipment for automatic good/bad board sorting. The user interface is 100% touch control—as easy to use as a tablet.
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Arcadia Test
Board stress analysis is an increasingly critical part of the test fixture build process today. Probe densities under BGA devices put tremendous pressure onto the solder joints of these devices. If the fixture is not designed properly, immediate damage can occur to the BGA’s, or even more devastating, future damage, which creates field failures. We can provide strain testing before shipping your fixture to insure that there are not excessive forces placed on your BGA parts. With the use of National Instruments Strain equipment, and tri-directional rosettes, we cycle test the board/fixture and measure and record the amount of strain from each corner of each BGA. Any over limit conditions are corrected before shipment. This service insures that your products will not be damaged at ICT, and help to reduce field failures from damaged components, compromised solder joints, or lifted pads.
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Zenith UHS -
Koh Young Technology
High-speed full 3D AOI that brings about a revolution in SMT process management Industry-leading speed for full 3D measuring inspection equipment skill solutions- Only solution in the industry to set inspection criteria according to IPC-610 standards- Performs defect diagnosis through measurement-based data and eliminates the causes of possible errors- Powerful 3D solder joint inspection
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5200 Advanced -
Rhesca Co., Ltd.
This is an ultra-high-sensitivity wettability tester developed to evaluate the solder wettability of ever-miniaturizing electronic components. Electronic devices, especially mobile devices, are becoming more compact and multi-functional. As the number of electronic components mounted on them increases and the pitch of connectors that connect each device increases, soldering parts are becoming increasingly miniaturized. expected to respond to further miniaturization of electronic components and miniaturization of joints in the future .
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Qingdao AIP Intelligent Instruments Co., Ltd
This tester is suitable for online or offline detection of various armature electrical properties, such as power tool motors, garden tools, vacuum cleaner motors, small household appliance motors, automobile motors, fitness equipment motors, permanent magnet micro-motors, etc. The tooling of the tester meets the requirements of arbitrary placement of the armature, and can automatically and accurately sort/track faulty solder joints; the equipment startup methods include buttons, remote control, and sliding cover; it meets the armature test of special processes such as double insulation, and automatically identifies solder joints, winding short circuit/open circuit , winding errors, poor welding and other problems; the tester can also automatically count the number of tests, the number of defectives and other data, which is convenient for quality management analysis.The tester test items mainly include:bar-to-bar resistance, diagonal resistance, welding resistance, insulation resistance, ac hi-pot, surge.
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PTR1102 -
Rhesca Co., Ltd.
In wire bonding in semiconductor manufacturing, electrodes are joined using gold wires of several tens of microns. In order to measure the pull (tensile) strength and ball shear (shear) strength of this gold wire, this machine has load detection accuracy and fine positioning accuracy. In addition, for the measurement of high load areas such as die shear strength and solder joint strength, this machine supports measurement in high load areas while maintaining accuracy in low load areas by replacing the sensor part.
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Panasonic Industrial Devices Sales Company of America
Panasonic offers a wide variety of Thick Film Current Sense Resistors (ERJ-B1, B2, xB, xBW, xCW) in a large range of case sizes and in wide terminal types for high solder joint reliability. The ERJ Series of Current Sense Resistors offers power ratings up to 2W with low ohmic ratings ranging from 5mΩ to 10Ω. Panasonic’s Thick Film Current Sense Resistor portfolio offers a more cost effective option with high reliability. Panasonic has a wide line of case size options ranging from 0402 to 2512 in conventional terminal and 0612 to 1020 for wide terminal.
